1. DCB ( Direct Ceramic Bond) Substrate

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1. DCB ( Direct Ceramic Bond) Substrate;

DCB-Substrates (Direct Copper Bond) - or DBC-Substrates (Direct Bond Copper) of AL2O3 (Alumina) or AIN (Aluminium Nitrid) is a widely acceptable and a timeproven technology for power electronic products. The high thermal conducctivity, high current capacity and heat dissation of the high-purity copper on ceramic make the direct bond copper substrate (DBC) essential for electronoc power applications.

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HHI HUBERT HEUSNER INDUSTRIEVERTRETUNGEN UND HANDEL
3. DBC (Direct Bondet Copper)
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DE

Defense Industry - Security, Sensitive Tools and Products

HHI HUBERT HEUSNER INDUSTRIEVERTRETUNGEN UND HANDEL
2. DCB ( Direct Ceramic Bond) Module
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DE

Defense Industry - Security, Sensitive Tools and Products

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